GRINDING
Equipment
Our grinders are used for backside thinning of a broad range of semiconductor and compound materials, including: silicon carbide, silicon, gallium arsenide, gallium nitride, sapphire, germanium, lithium niobate, lithium tantalate, and indium phosphide.
CMP
Equipment
Our production-proven CMP equipment is ideal for a broad range of applications, including oxide, silicon oxide, silicon nitride, tungsten, SOI, and other thin film applications. With over twenty years of CMP process experience, our applications engineers are ready to assist you in developing a process that achieves your requirements.
RE-MANUFACTURED
Equipment
Our promise to you is to always provide the highest-quality equipment available, and that includes our re-manufactured equipment. All of our pre-owned equipment goes through a rigorous remanufacturing process, which includes a full inspection, component repair or replacement, and factory testing. Each refurbished tool is put through the same burn in process that new systems go through to ensure that every system is fully functional and is certified to meet Revasum’s factory specifications.
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